BYCHIPS is the stocking distributor for SOMAM3703-31-1780AKIR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SOMAM3703-31-1780AKIR by email, we will give you a best price according your plan.
Buy SOMAM3703-31-1780AKIR with BYCHPS
Buy with guarantee
SOMAM3703-31-1780AKIR
- Part Number:
- SOMAM3703-31-1780AKIR
- Manufacturer:
- Logic PD, Inc.
- Description:
- SYSTEM ON MODULE WIRELESS TORP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12594 Pieces
- Data sheet:
- SOMAM3703-31-1780AKIR.pdf
Introduction
Specifications
| Speed: | 800MHz |
|---|---|
| Series: | AM37x |
| RAM Size: | 256MB |
| Other Names: | 460-3525 |
| Operating Temperature: | -40°C ~ 85°C |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Module/Board Type: | MPU Core |
| Manufacturer Part Number: | SOMAM3703-31-1780AKIR |
| Flash Size: | 512MB |
| Expanded Description: | AM37x Embedded Module ARM® Cortex®-A8, AM3703 800MHz 256MB 512MB |
| Description: | SYSTEM ON MODULE WIRELESS TORP |
| Core Processor: | ARM® Cortex®-A8, AM3703 |
| Connector Type: | Board-to-Board (BTB) Socket - 200 |
| Co-Processor: | - |
| Email: | [email protected] |
Related parts for SOMAM3703-31-1780AKIR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SOMAM3703-30-1780AKIR | Logic | SYSTEM ON MODULE TORP | Inquiry |
 |
SOMAM3703-32-1780AKIR | Logic | SOM TORPEDO WIRELESS 800MHZ IND | Inquiry |
 |
SOMAM3703-10-2780HFCR | Logic | SYSTEM ON MODULE LV AM3703 | Inquiry |
 |
SOMAM3703-20-1780AGCR | Logic | SYSTEM ON MODULE TORP AM3703 | Inquiry |
 |
SOMAM3517-10-1780RJXR | Logic | SYSTEM ON MODULE AM3517 | Inquiry |
 |
SOMAM3517-10-1780FJCR | Logic | IC SOM AM3517 MODULE | Inquiry |
 |
SOMAM3517-10-1780FJIR | Logic | SYSTEM ON MODULE AM3517 | Inquiry |
 |
SOMAM3517-10-1780RJCR | Logic | IC SOM AM3517 MODULE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers