BYCHIPS is the stocking distributor for SN75LVPE802RTJR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SN75LVPE802RTJR by email, we will give you a best price according your plan.
Buy SN75LVPE802RTJR with BYCHPS
Buy with guarantee
SN75LVPE802RTJR
- Part Number:
- SN75LVPE802RTJR
- Manufacturer:
- Description:
- IC SATA EXPRESS 2 CHAN 20QFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12773 Pieces
- Data sheet:
- SN75LVPE802RTJR.pdf
Introduction
Specifications
| Voltage - Supply: | 3 V ~ 3.6 V |
|---|---|
| Type: | Buffer, ReDriver |
| Supplier Device Package: | 20-QFN (4x4) |
| Signal Conditioning: | Input Equalization, Output De-Emphasis |
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 20-WFQFN Exposed Pad |
| Output: | VML |
| Operating Temperature: | 0°C ~ 85°C |
| Number of Channels: | 2 |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | SN75LVPE802RTJR |
| Input: | CML |
| Expanded Description: | Buffer, ReDriver 2 Channel 8Gbps 20-QFN (4x4) |
| Description: | IC SATA EXPRESS 2 CHAN 20QFN |
| Delay Time: | 323ps |
| Data Rate (Max): | 8Gbps |
| Current - Supply: | 57mA |
| Capacitance - Input: | - |
| Applications: | SATA |
| Email: | [email protected] |
Related parts for SN75LVPE802RTJR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PCA9511AD,118 | NXP USA Inc. | IC ACCELERATOR I2C HOTSWAP 8SO | Inquiry |
|
DS25BR101TSD/NOPB | Texas Instruments | IC REDRIVER LVDS 1CH 8WSON | Inquiry |
|
SN75LVPE801DRFT | Texas Instruments | IC EQUALIZER SATA 8GBPS 8WSON | Inquiry |
 |
PI3EQX7741AIZDE | Diodes Incorporated | IC REDRIVER USB 3.0 2CH 20TQFN | Inquiry |
|
SN75LVPE801DRFR | Texas Instruments | IC EQUALIZER SATA 8GBPS 8WSON | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers