BYCHIPS is the stocking distributor for SLP331M160A1P3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SLP331M160A1P3 by email, we will give you a best price according your plan.
Buy SLP331M160A1P3 with BYCHPS
Buy with guarantee
SLP331M160A1P3
- Part Number:
- SLP331M160A1P3
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP ALUM 330UF 20% 160V SNAP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14773 Pieces
- Data sheet:
- SLP331M160A1P3.pdf
Introduction
Specifications
| Voltage Rating: | 160V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.866" Dia (22.00mm) |
| Series: | SLP |
| Ripple Current: | 1.2A |
| Polarization: | - |
| Packaging: | Bulk |
| Package / Case: | Radial, Can - Snap-In |
| Other Names: | 338-1489 SLP331M160A1P3-ND |
| Operating Temperature: | -25°C ~ 105°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 21 Weeks |
| Manufacturer Part Number: | SLP331M160A1P3 |
| Lifetime @ Temp.: | 3000 Hrs @ 105°C |
| Lead Spacing: | 0.394" (10.00mm) |
| Impedance: | - |
| Height - Seated (Max): | 0.984" (25.00mm) |
| Expanded Description: | 330µF 160V Aluminum Capacitors Radial, Can - Snap-In 603 mOhm 3000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 603 mOhm |
| Description: | CAP ALUM 330UF 20% 160V SNAP |
| Capacitance: | 330µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for SLP331M160A1P3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers