BYCHIPS is the stocking distributor for SIA915DJ-T1-GE3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SIA915DJ-T1-GE3 by email, we will give you a best price according your plan.
Buy SIA915DJ-T1-GE3 with BYCHPS
Buy with guarantee
SIA915DJ-T1-GE3
- Part Number:
- SIA915DJ-T1-GE3
- Manufacturer:
- Vishay / Siliconix
- Description:
- MOSFET 2P-CH 30V 4.5A SC-70-6L
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19884 Pieces
- Data sheet:
- SIA915DJ-T1-GE3.pdf
Introduction
Specifications
| Vgs(th) (Max) @ Id: | 2.2V @ 250µA |
|---|---|
| Supplier Device Package: | PowerPAK® SC-70-6 Dual |
| Series: | TrenchFET® |
| Rds On (Max) @ Id, Vgs: | 87 mOhm @ 2.9A, 10V |
| Power - Max: | 6.5W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | PowerPAK® SC-70-6 Dual |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 24 Weeks |
| Manufacturer Part Number: | SIA915DJ-T1-GE3 |
| Input Capacitance (Ciss) (Max) @ Vds: | 275pF @ 15V |
| Gate Charge (Qg) (Max) @ Vgs: | 9nC @ 10V |
| FET Type: | 2 P-Channel (Dual) |
| FET Feature: | Logic Level Gate |
| Expanded Description: | Mosfet Array 2 P-Channel (Dual) 30V 4.5A 6.5W Surface Mount PowerPAK® SC-70-6 Dual |
| Drain to Source Voltage (Vdss): | 30V |
| Description: | MOSFET 2P-CH 30V 4.5A SC-70-6L |
| Current - Continuous Drain (Id) @ 25°C: | 4.5A |
| Email: | [email protected] |
Related parts for SIA915DJ-T1-GE3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers