BYCHIPS is the stocking distributor for SFA37S7.5K156B, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SFA37S7.5K156B by email, we will give you a best price according your plan.
Buy SFA37S7.5K156B with BYCHPS
Buy with guarantee
SFA37S7.5K156B
- Part Number:
- SFA37S7.5K156B
- Manufacturer:
- Cornell Dubilier Electronics
- Description:
- CAP FILM 7.5UF 370VAC QC TERM
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 14176 Pieces
- Data sheet:
- SFA37S7.5K156B.pdf
Introduction
Specifications
| Voltage Rating - DC: | - |
|---|---|
| Voltage Rating - AC: | 370V |
| Tolerance: | ±10% |
| Termination: | Quick Connect, Disconnect |
| Size / Dimension: | 2.160" L x 1.310" W (54.86mm x 33.27mm), Lip |
| Series: | SF |
| Packaging: | Bulk |
| Package / Case: | Radial, Can |
| Operating Temperature: | -40°C ~ 70°C |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | SFA37S7.5K156B |
| Lead Spacing: | 0.810" (20.57mm) |
| Height - Seated (Max): | 1.680" (42.67mm) |
| Features: | - |
| Expanded Description: | 7.5µF ±10% Film Capacitor 370V Polypropylene (PP), Metallized Radial, Can |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polypropylene (PP), Metallized |
| Description: | CAP FILM 7.5UF 370VAC QC TERM |
| Capacitance: | 7.5µF |
| Applications: | Motor Run |
| Email: | [email protected] |
Related parts for SFA37S7.5K156B
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog