BYCHIPS is the stocking distributor for SC68C752BIBS,157, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for SC68C752BIBS,157 by email, we will give you a best price according your plan.
Buy SC68C752BIBS,157 with BYCHPS
Buy with guarantee
SC68C752BIBS,157
- Part Number:
- SC68C752BIBS,157
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC UART DUAL 32HVQFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16717 Pieces
- Data sheet:
- SC68C752BIBS,157.pdf
Introduction
Specifications
| With Modem Control: | Yes |
|---|---|
| With IrDA Encoder/Decoder: | Yes |
| With False Start Bit Detection: | Yes |
| With Auto Flow Control: | Yes |
| Voltage - Supply: | 2.5V, 3.3V, 5V |
| Supplier Device Package: | 32-HVQFN (5x5) |
| Series: | - |
| Protocol: | - |
| Packaging: | Tray |
| Package / Case: | 32-VFQFN Exposed Pad |
| Other Names: | 935280969157 SC68C752BIBS SC68C752BIBS-ND |
| Number of Channels: | 2, DUART |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | SC68C752BIBS,157 |
| Features: | - |
| FIFO's: | 64 Byte |
| Description: | IC UART DUAL 32HVQFN |
| Data Rate (Max): | 5Mbps |
| Email: | [email protected] |
Related parts for SC68C752BIBS,157
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
SC68C752BIB48,128 | NXP USA Inc. | IC UART DUAL 48LQFP | Inquiry |
 |
SC68C752BIBS,128 | NXP USA Inc. | IC UART DUAL 32HVQFN | Inquiry |
|
SC68C752BIBS,151 | NXP USA Inc. | IC UART DUAL W/FIFO 32-HVQFN | Inquiry |
|
SC68C752BIB48,157 | NXP USA Inc. | IC UART DUAL 48LQFP | Inquiry |
|
SC68C752BIB48,151 | NXP USA Inc. | IC UART DUAL W/FIFO 48-LQFP | Inquiry |
|
SC68C652BIB48,157 | NXP USA Inc. | IC UART DUAL 48LQFP | Inquiry |
|
SC68C2550BIB48,151 | NXP USA Inc. | IC UART DUAL W/FIFO 48-LQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers