BYCHIPS is the stocking distributor for S301RP128R2R7W, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for S301RP128R2R7W by email, we will give you a best price according your plan.
Buy S301RP128R2R7W with BYCHPS
Buy with guarantee
S301RP128R2R7W
- Part Number:
- S301RP128R2R7W
- Manufacturer:
- KEMET
- Description:
- CAP 1200F 0% 2.7V CHASSIS MOUNT
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15609 Pieces
- Data sheet:
- S301RP128R2R7W.pdf
Introduction
Specifications
| Voltage - Rated: | 2.7V |
|---|---|
| Tolerance: | -0% |
| Termination: | Weld Stud |
| Size / Dimension: | 2.390" Dia x 3.169" L (60.70mm x 80.50mm) |
| Series: | S301 |
| Packaging: | Bulk |
| Package / Case: | Axial, Can - Screw Terminals |
| Other Names: | 399-11547 |
| Operating Temperature: | -40°C ~ 65°C |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | S301RP128R2R7W |
| Lifetime @ Temp.: | 1000 Hrs @ 65°C |
| Lead Spacing: | 0.787" (20.00mm) |
| Height - Seated (Max): | - |
| Expanded Description: | 1200F -0%(EDLC) Supercapacitor 2.7V Axial, Can - Screw Terminals 0.25 mOhm @ 1kHz 1000 Hrs @ 65°C |
| ESR (Equivalent Series Resistance): | 0.25 mOhm @ 1kHz |
| Description: | CAP 1200F 0% 2.7V CHASSIS MOUNT |
| Capacitance: | 1200F |
| Email: | [email protected] |
Related parts for S301RP128R2R7W
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
CDHC821K2R3SR | Cornell Dubilier Electronics (CDE) | CAP 820F -5% +10% 2.3V T/H | Inquiry |
 |
EEC-F5R5U155 | Panasonic Electronic Components | CAP 1.5F -20% +80% 5.5V T/H | Inquiry |
 |
EEC-S5R5H105 | Panasonic Electronic Components | CAP 1F -20% +80% 5.5V T/H | Inquiry |
 |
EEC-F5R5H104N | Panasonic Electronic Components | CAP .1F 5.5V T/H | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers