BYCHIPS is the stocking distributor for RMLV0816BGSD-4S2#AC0, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RMLV0816BGSD-4S2#AC0 by email, we will give you a best price according your plan.
Buy RMLV0816BGSD-4S2#AC0 with BYCHPS
Buy with guarantee
RMLV0816BGSD-4S2#AC0
- Part Number:
- RMLV0816BGSD-4S2#AC0
- Manufacturer:
- Renesas Electronics America
- Description:
- IC SRAM 8MBIT 45NS 52TSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19754 Pieces
- Data sheet:
- RMLV0816BGSD-4S2#AC0.pdf
Introduction
Specifications
| Voltage - Supply: | 2.4 V ~ 3.6 V |
|---|---|
| Speed: | 45ns |
| Series: | - |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Volatile |
| Memory Size: | 8Mb (1M x 8, 512K x 16) |
| Memory Format: | SRAM |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | RMLV0816BGSD-4S2#AC0 |
| Interface: | Parallel |
| Description: | IC SRAM 8MBIT 45NS 52TSOP |
| Email: | [email protected] |
Related parts for RMLV0816BGSD-4S2#AC0
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
RMLV0816BGBG-4S2#AC0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 48FBGA | Inquiry |
|
RMLV0816BGSD-4S2#HC0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 52TSOP | Inquiry |
|
RMLV0816BGSA-4S2#KA0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 48TSOP | Inquiry |
|
RMLV0816BGSB-4S2#HA0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 44TSOP | Inquiry |
|
RMLV0816BGSB-4S2#AA0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 44TSOP | Inquiry |
|
RMLV0816BGBG-4S2#KC0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 48FBGA | Inquiry |
|
RMLV0816BGSA-4S2#AA0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 48TSOP | Inquiry |
|
RMLV0808BGBG-4S2#KC0 | Renesas Electronics America | IC SRAM 8MBIT 45NS 48FBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers