BYCHIPS is the stocking distributor for RM707024, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RM707024 by email, we will give you a best price according your plan.
Buy RM707024 with BYCHPS
Buy with guarantee
RM707024
- Part Number:
- RM707024
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE 3PDT 16A 24V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS Compliant
- Available Quantity:
- 13859 Pieces
- Data sheet:
- RM707024.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 18 VDC |
|---|---|
| Turn Off Voltage (Min): | 2.4 VDC |
| Termination Style: | PC Pin |
| Switching Voltage: | 440VAC - Max |
| Series: | RM, SCHRACK |
| Release Time: | 10ms |
| Relay Type: | General Purpose |
| Packaging: | Bulk |
| Other Names: | 9-1393146-8 9-1393146-8-ND 913931468 RM707024-ND |
| Operating Temperature: | -45°C ~ 60°C |
| Operate Time: | 15ms |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | RM707024 |
| Features: | Mechanical Indicator |
| Expanded Description: | General Purpose Relay 3PDT (3 Form C) 24VDC Coil Through Hole |
| Description: | RELAY GEN PURPOSE 3PDT 16A 24V |
| Contact Rating (Current): | 16A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PDT (3 Form C) |
| Coil Voltage: | 24VDC |
| Coil Type: | Non Latching |
| Coil Resistance: | 345 Ohms |
| Coil Power: | 1.7 W |
| Coil Current: | 70.8mA |
| Email: | [email protected] |
Related parts for RM707024
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers