BYCHIPS is the stocking distributor for RM30TPM-H, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RM30TPM-H by email, we will give you a best price according your plan.
Buy RM30TPM-H with BYCHPS
Buy with guarantee
RM30TPM-H
- Part Number:
- RM30TPM-H
- Manufacturer:
- Powerex, Inc.
- Description:
- DIODE 3-PHASE BRIDGE 800V 60A
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17750 Pieces
- Data sheet:
- RM30TPM-H.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 800V |
|---|---|
| Voltage - Forward (Vf) (Max) @ If: | 1.2V @ 60A |
| Technology: | Standard |
| Supplier Device Package: | Module |
| Series: | - |
| Packaging: | Bulk |
| Package / Case: | Module |
| Operating Temperature: | -40°C ~ 150°C (TJ) |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | RM30TPM-H |
| Expanded Description: | Bridge Rectifier Three Phase 800V 60A Chassis Mount Module |
| Diode Type: | Three Phase |
| Description: | DIODE 3-PHASE BRIDGE 800V 60A |
| Current - Reverse Leakage @ Vr: | 10mA @ 800V |
| Current - Average Rectified (Io): | 60A |
| Email: | [email protected] |
Related parts for RM30TPM-H
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers