BYCHIPS is the stocking distributor for RM302730CF, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RM302730CF by email, we will give you a best price according your plan.
Buy RM302730CF with BYCHPS
Buy with guarantee
RM302730CF
- Part Number:
- RM302730CF
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Description:
- RELAY GEN PURPOSE 3PDT 10A 230V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 12298 Pieces
- Data sheet:
- RM302730CF.pdf
Introduction
Specifications
| Turn On Voltage (Max): | 184 VAC |
|---|---|
| Turn Off Voltage (Min): | 69 VAC |
| Termination Style: | Plug In, Quick Connect - 0.187" (4.7mm) |
| Switching Voltage: | 440VAC - Max |
| Series: | RM, SCHRACK |
| Relay Type: | General Purpose |
| Packaging: | Tray |
| Other Names: | 5-1419150-3 |
| Operating Temperature: | -45°C ~ 55°C |
| Mounting Type: | Socketable |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | RM302730CF |
| Features: | Mechanical Indicator |
| Expanded Description: | General Purpose Relay 3PDT (3 Form C) 230VAC Coil Socketable |
| Description: | RELAY GEN PURPOSE 3PDT 10A 230V |
| Contact Rating (Current): | 10A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PDT (3 Form C) |
| Coil Voltage: | 230VAC |
| Coil Type: | Non Latching |
| Coil Resistance: | 8.3 kOhms |
| Coil Power: | 2.3 VA |
| Email: | [email protected] |
Related parts for RM302730CF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog