BYCHIPS is the stocking distributor for RCH855NP-2R5M, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RCH855NP-2R5M by email, we will give you a best price according your plan.
Buy RCH855NP-2R5M with BYCHPS
Buy with guarantee
RCH855NP-2R5M
- Part Number:
- RCH855NP-2R5M
- Manufacturer:
- Sumida Corporation
- Description:
- FIXED IND 2.5UH 3.1A 23 MOHM TH
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18329 Pieces
- Data sheet:
- RCH855NP-2R5M.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | - |
| Size / Dimension: | 0.307" Dia (7.80mm) |
| Shielding: | Unshielded |
| Series: | RCH-855 |
| Ratings: | - |
| Q @ Freq: | - |
| Packaging: | Bulk |
| Package / Case: | Radial |
| Operating Temperature: | -40°C ~ 100°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Manufacturer Standard Lead Time: | 13 Weeks |
| Manufacturer Part Number: | RCH855NP-2R5M |
| Inductance: | 2.5µH |
| Height - Seated (Max): | 0.217" (5.50mm) |
| Frequency - Test: | 7.96MHz |
| Frequency - Self Resonant: | - |
| Expanded Description: | 2.5µH Unshielded Wirewound Inductor 3.1A 23 mOhm Max Radial |
| Description: | FIXED IND 2.5UH 3.1A 23 MOHM TH |
| DC Resistance (DCR): | 23 mOhm Max |
| Current Rating: | 3.1A |
| Current - Saturation: | 4.5A |
| Email: | [email protected] |
Related parts for RCH855NP-2R5M
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog