BYCHIPS is the stocking distributor for RAVF324DJT3K30, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RAVF324DJT3K30 by email, we will give you a best price according your plan.
Buy RAVF324DJT3K30 with BYCHPS
Buy with guarantee
RAVF324DJT3K30
- Part Number:
- RAVF324DJT3K30
- Manufacturer:
- Stackpole Electronics, Inc.
- Description:
- RES ARRAY 4 RES 3.3K OHM 2012
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15039 Pieces
- Data sheet:
- 1.RAVF324DJT3K30.pdf2.RAVF324DJT3K30.pdf
Introduction
Specifications
| Tolerance: | ±5% |
|---|---|
| Temperature Coefficient: | ±200ppm/°C |
| Supplier Device Package: | - |
| Size / Dimension: | 0.200" L x 0.122" W (5.08mm x 3.10mm) |
| Series: | RAVF |
| Resistance (Ohms): | 3.3k |
| Power Per Element: | 125mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2012, Convex, Long Side Terminals |
| Other Names: | RAV 324D 3.3K 5% R RAV324D3.3K5%R RAV324D3.3K5%R-ND RAV324D3.3KJR RAV324D3.3KJR-ND |
| Operating Temperature: | -55°C ~ 125°C |
| Number of Resistors: | 4 |
| Number of Pins: | 8 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | RAVF324DJT3K30 |
| Height - Seated (Max): | 0.026" (0.65mm) |
| Expanded Description: | 3.3k Ohm ±5% 125mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 2012, Convex, Long Side Terminals |
| Description: | RES ARRAY 4 RES 3.3K OHM 2012 |
| Circuit Type: | Isolated |
| Applications: | - |
| Email: | [email protected] |
Related parts for RAVF324DJT3K30
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog