BYCHIPS is the stocking distributor for RAVF164DFT130K, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RAVF164DFT130K by email, we will give you a best price according your plan.
Buy RAVF164DFT130K with BYCHPS
Buy with guarantee
RAVF164DFT130K
- Part Number:
- RAVF164DFT130K
- Manufacturer:
- Stackpole Electronics, Inc.
- Description:
- RES ARRAY 4 RES 130K OHM 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16855 Pieces
- Data sheet:
- 1.RAVF164DFT130K.pdf2.RAVF164DFT130K.pdf
Introduction
Specifications
| Tolerance: | ±1% |
|---|---|
| Temperature Coefficient: | ±200ppm/°C |
| Supplier Device Package: | - |
| Size / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Series: | RAVF |
| Resistance (Ohms): | 130k |
| Power Per Element: | 62.5mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric), Convex, Long Side Terminals |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Resistors: | 4 |
| Number of Pins: | 8 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | RAVF164DFT130K |
| Height - Seated (Max): | 0.024" (0.60mm) |
| Expanded Description: | 130k Ohm ±1% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 1206 (3216 Metric), Convex, Long Side Terminals |
| Description: | RES ARRAY 4 RES 130K OHM 1206 |
| Circuit Type: | Isolated |
| Applications: | Automotive AEC-Q200 |
| Email: | [email protected] |
Related parts for RAVF164DFT130K
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers