BYCHIPS is the stocking distributor for RAVF162DJT2K40, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for RAVF162DJT2K40 by email, we will give you a best price according your plan.
Buy RAVF162DJT2K40 with BYCHPS
Buy with guarantee
RAVF162DJT2K40
- Part Number:
- RAVF162DJT2K40
- Manufacturer:
- Stackpole Electronics, Inc.
- Description:
- RES ARRAY 2 RES 2.4K OHM 0606
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19747 Pieces
- Data sheet:
- 1.RAVF162DJT2K40.pdf2.RAVF162DJT2K40.pdf
Introduction
Specifications
| Tolerance: | ±5% |
|---|---|
| Temperature Coefficient: | ±200ppm/°C |
| Supplier Device Package: | - |
| Size / Dimension: | 0.063" L x 0.063" W (1.60mm x 1.60mm) |
| Series: | RAVF |
| Resistance (Ohms): | 2.4k |
| Power Per Element: | 62.5mW |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0606 (1616 Metric), Convex, Long Side Terminals |
| Other Names: | RAV 162D 2.4K 5% R RAV162D2.4K5%R RAV162D2.4K5%R-ND RAV162D2.4KJR RAV162D2.4KJR-ND |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Resistors: | 2 |
| Number of Pins: | 4 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 11 Weeks |
| Manufacturer Part Number: | RAVF162DJT2K40 |
| Height - Seated (Max): | 0.026" (0.65mm) |
| Expanded Description: | 2.4k Ohm ±5% 62.5mW Power Per Element Isolated Resistor Network/Array ±200ppm/°C 0606 (1616 Metric), Convex, Long Side Terminals |
| Description: | RES ARRAY 2 RES 2.4K OHM 0606 |
| Circuit Type: | Isolated |
| Applications: | - |
| Email: | [email protected] |
Related parts for RAVF162DJT2K40
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers