BYCHIPS is the stocking distributor for R9G03212XX, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for R9G03212XX by email, we will give you a best price according your plan.
Buy R9G03212XX with BYCHPS
Buy with guarantee
R9G03212XX
- Part Number:
- R9G03212XX
- Manufacturer:
- Powerex, Inc.
- Description:
- DIODE MODULE 3.2KV 1200A DO200AA
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14593 Pieces
- Data sheet:
- R9G03212XX.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 1.45V @ 1500A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 3200V (3.2kV) |
| Supplier Device Package: | DO-200AA, R62 |
| Speed: | Standard Recovery >500ns, > 200mA (Io) |
| Series: | - |
| Reverse Recovery Time (trr): | 25µs |
| Packaging: | Bulk |
| Package / Case: | DO-200AA, A-PUK |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 12 Weeks |
| Manufacturer Part Number: | R9G03212XX |
| Expanded Description: | Diode Standard 3200V (3.2kV) 1200A Chassis Mount DO-200AA, R62 |
| Diode Type: | Standard |
| Description: | DIODE MODULE 3.2KV 1200A DO200AA |
| Current - Reverse Leakage @ Vr: | 150mA @ 3200V |
| Current - Average Rectified (Io): | 1200A |
| Capacitance @ Vr, F: | - |
| Email: | [email protected] |
Related parts for R9G03212XX
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers