BYCHIPS is the stocking distributor for R5F562T7BDFF#V3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for R5F562T7BDFF#V3 by email, we will give you a best price according your plan.
Buy R5F562T7BDFF#V3 with BYCHPS
Buy with guarantee
R5F562T7BDFF#V3
- Part Number:
- R5F562T7BDFF#V3
- Manufacturer:
- Renesas Electronics America
- Description:
- IC MCU 32BIT 128KB FLASH 80LQFP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13372 Pieces
- Data sheet:
- 1.R5F562T7BDFF#V3.pdf2.R5F562T7BDFF#V3.pdf
Introduction
Specifications
| Voltage - Supply (Vcc/Vdd): | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 80-LQFP (14x14) |
| Speed: | 100MHz |
| Series: | RX600 |
| RAM Size: | 8K x 8 |
| Program Memory Type: | FLASH |
| Program Memory Size: | 128KB (128K x 8) |
| Peripherals: | DMA, LVD, POR, PWM, WDT |
| Packaging: | Tray |
| Package / Case: | 80-LQFP |
| Oscillator Type: | Internal |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of I/O: | 44 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 24 Weeks |
| Manufacturer Part Number: | R5F562T7BDFF#V3 |
| Expanded Description: | RX RX600 Microcontroller IC 32-Bit 100MHz 128KB (128K x 8) FLASH 80-LQFP (14x14) |
| EEPROM Size: | - |
| Description: | IC MCU 32BIT 128KB FLASH 80LQFP |
| Data Converters: | A/D 4x10b, 8x12b |
| Core Size: | 32-Bit |
| Core Processor: | RX |
| Connectivity: | CAN, I²C, LIN, SCI, SPI |
| Email: | [email protected] |
Related parts for R5F562T7BDFF#V3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers