BYCHIPS is the stocking distributor for QRD0630R30, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for QRD0630R30 by email, we will give you a best price according your plan.
Buy QRD0630R30 with BYCHPS
Buy with guarantee
QRD0630R30
- Part Number:
- QRD0630R30
- Manufacturer:
- Powerex, Inc.
- Description:
- DIODE GEN PURP 600V 210A
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15948 Pieces
- Data sheet:
- QRD0630R30.pdf
Introduction
Specifications
| Voltage - Forward (Vf) (Max) @ If: | 2.5V @ 210A |
|---|---|
| Voltage - DC Reverse (Vr) (Max): | 600V |
| Supplier Device Package: | Module |
| Speed: | Fast Recovery = 200mA (Io) |
| Series: | - |
| Reverse Recovery Time (trr): | 120ns |
| Packaging: | Bulk |
| Package / Case: | Module |
| Operating Temperature - Junction: | -40°C ~ 150°C |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | QRD0630R30 |
| Expanded Description: | Diode Array 1 Pair Series Connection Standard 600V 210A (DC) Chassis Mount Module |
| Diode Type: | Standard |
| Diode Configuration: | 1 Pair Series Connection |
| Description: | DIODE GEN PURP 600V 210A |
| Current - Reverse Leakage @ Vr: | 1mA @ 600V |
| Current - Average Rectified (Io) (per Diode): | 210A (DC) |
| Email: | [email protected] |
Related parts for QRD0630R30
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers