BYCHIPS is the stocking distributor for PXAC201602FCV1XWSA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PXAC201602FCV1XWSA1 by email, we will give you a best price according your plan.
Buy PXAC201602FCV1XWSA1 with BYCHPS
Buy with guarantee
PXAC201602FCV1XWSA1
- Part Number:
- PXAC201602FCV1XWSA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- IC AMP RF LDMOS
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18147 Pieces
- Data sheet:
- PXAC201602FCV1XWSA1.pdf
Introduction
Specifications
| Voltage - Test: | 28V |
|---|---|
| Voltage - Rated: | 65V |
| Transistor Type: | LDMOS |
| Supplier Device Package: | H-37248-4 |
| Series: | - |
| Power - Output: | 22.5W |
| Packaging: | Tray |
| Package / Case: | H-37248-4 |
| Other Names: | SP001212218 |
| Noise Figure: | - |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | PXAC201602FCV1XWSA1 |
| Gain: | 17.7dB |
| Frequency: | 2.02GHz |
| Expanded Description: | RF Mosfet LDMOS 28V 360mA 2.02GHz 17.7dB 22.5W H-37248-4 |
| Description: | IC AMP RF LDMOS |
| Current Rating: | - |
| Current - Test: | 360mA |
| Email: | [email protected] |
Related parts for PXAC201602FCV1XWSA1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PXAC201202FCV2R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PXAC201602FCV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PXAC201202FCV2R0XTMA1 | Infineon Technologies | IC AMP RF LDMOS H-37248-4 | Inquiry |
|
PXAC201202FCV2XWSA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PXAC201602FCV1R0XTMA1 | Infineon Technologies | IC AMP RF LDMOS H-37248-4 | Inquiry |
|
PXAC203302FVV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers