BYCHIPS is the stocking distributor for PTFB182503FLV2R0XTMA1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PTFB182503FLV2R0XTMA1 by email, we will give you a best price according your plan.
Buy PTFB182503FLV2R0XTMA1 with BYCHPS
Buy with guarantee
PTFB182503FLV2R0XTMA1
- Part Number:
- PTFB182503FLV2R0XTMA1
- Manufacturer:
- International Rectifier (Infineon Technologies)
- Description:
- IC AMP RF LDMOS H-34288-4
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14364 Pieces
- Data sheet:
- PTFB182503FLV2R0XTMA1.pdf
Introduction
Specifications
| Voltage - Test: | 30V |
|---|---|
| Voltage - Rated: | 65V |
| Supplier Device Package: | H-33288-6 |
| Series: | - |
| Power - Output: | 50W |
| Packaging: | Cut Tape (CT) |
| Package / Case: | H-33288-6 |
| Other Names: | SP001413914 |
| Noise Figure: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | PTFB182503FLV2R0XTMA1 |
| Gain: | 19dB |
| Frequency: | 1.88GHz |
| Expanded Description: | RF Mosfet 30V 1.85A 1.88GHz 19dB 50W H-33288-6 |
| Description: | IC AMP RF LDMOS H-34288-4 |
| Current Rating: | - |
| Current - Test: | 1.85A |
| Email: | [email protected] |
Related parts for PTFB182503FLV2R0XTMA1
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PTFB182503ELV1R0XTMA1 | Infineon Technologies | IC AMP RF LDMOS H-33288-6 | Inquiry |
|
PTFB182557SHV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PTFB182503FLV2R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PTFB182503ELV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PTFB181702FCV1R0XTMA1 | Infineon Technologies | IC AMP RF LDMOS H-37248-4 | Inquiry |
|
PTFB183404EV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
|
PTFB183404FV2R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers