BYCHIPS is the stocking distributor for PSS20S92F6-AG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PSS20S92F6-AG by email, we will give you a best price according your plan.
Buy PSS20S92F6-AG with BYCHPS
Buy with guarantee
PSS20S92F6-AG
- Part Number:
- PSS20S92F6-AG
- Manufacturer:
- Powerex, Inc.
- Description:
- MOD IPM 6-PAC 20A 600V DIP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19253 Pieces
Introduction
Specifications
| Voltage - Isolation: | 1500Vrms |
|---|---|
| Voltage: | 600V |
| Type: | IGBT |
| Series: | - |
| Package / Case: | 25-PowerDIP Module (1.134", 28.80mm) |
| Other Names: | 835-1159 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 20 Weeks |
| Manufacturer Part Number: | PSS20S92F6-AG |
| Expanded Description: | Power Driver Module IGBT 3 Phase 600V 20A 25-PowerDIP Module (1.134", 28.80mm) |
| Description: | MOD IPM 6-PAC 20A 600V DIP |
| Current: | 20A |
| Configuration: | 3 Phase |
| Email: | [email protected] |
Related parts for PSS20S92F6-AG
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PM50B6L1C060 | Powerex Inc. | MOD IPM H-BRIDGE CHOPP 50A 600V | Inquiry |
 |
IKCM15R60GDXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Inquiry |
 |
PSS20S71F6 | Powerex Inc. | MOD IPM 6-PAC 20A 600V DIP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers