BYCHIPS is the stocking distributor for PM75B6L1C060, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for PM75B6L1C060 by email, we will give you a best price according your plan.
Buy PM75B6L1C060 with BYCHPS
Buy with guarantee
PM75B6L1C060
- Part Number:
- PM75B6L1C060
- Manufacturer:
- Powerex, Inc.
- Description:
- MOD IPM H-BRIDGE L1 75A 600V
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18686 Pieces
- Data sheet:
- 1.PM75B6L1C060.pdf2.PM75B6L1C060.pdf
Introduction
Specifications
| Voltage - Isolation: | 2500Vrms |
|---|---|
| Voltage: | 600V |
| Type: | IGBT |
| Series: | Intellimod™ |
| Package / Case: | Power Module |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | PM75B6L1C060 |
| Expanded Description: | Power Driver Module IGBT H-Bridge 600V 75A Power Module |
| Description: | MOD IPM H-BRIDGE L1 75A 600V |
| Current: | 75A |
| Configuration: | H-Bridge |
| Email: | [email protected] |
Related parts for PM75B6L1C060
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
PM75B4L1C060 | Powerex Inc. | MOD IPM H-BRIDGE L1 75A 600V | Inquiry |
|
PM75B4LA060 | Powerex Inc. | MOD IPM L-SERIES 600V 75A | Inquiry |
|
PM75B5L1C060 | Powerex Inc. | MOD IPM H-BRIDGE L1 75A 600V | Inquiry |
|
PM75RL1A120 | Powerex Inc. | MOD IPM 7-PAC L1 75A 1200V | Inquiry |
|
PM100RL1A060 | Powerex Inc. | MOD IPM 7-PAC L1 100A 600V | Inquiry |
|
PM50RL1B060 | Powerex Inc. | MOD IPM 7-PAC L1 50A 600V | Inquiry |
|
PM75B5LA060 | Powerex Inc. | MOD IPM L-SERIES 600V 75A | Inquiry |
|
PM75B4LB060 | Powerex Inc. | MOD IPM L-SERIES 600V 75A | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers