BYCHIPS is the stocking distributor for NT25L51-PR, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NT25L51-PR by email, we will give you a best price according your plan.
Buy NT25L51-PR with BYCHPS
Buy with guarantee
NT25L51-PR
- Part Number:
- NT25L51-PR
- Manufacturer:
- Semtech
- Description:
- IC AMP TIA AGC OC48/GPONG DIE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18884 Pieces
- Data sheet:
- NT25L51-PR.pdf
Introduction
Specifications
| Type: | Transimpedance Amplifier |
|---|---|
| Supplier Device Package: | Die |
| Series: | - |
| Packaging: | Bulk |
| Package / Case: | Die |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | NT25L51-PR |
| Expanded Description: | Transimpedance Amplifier IC Die |
| Description: | IC AMP TIA AGC OC48/GPONG DIE |
| Applications: | - |
| Email: | [email protected] |
Related parts for NT25L51-PR
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
NT25L59-GRP8 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Inquiry |
|
NT25L59-PR | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Inquiry |
|
NT25L51-WP | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Inquiry |
|
NT25L59-GRP6 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Inquiry |
|
NT25L51-GRP8 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Inquiry |
|
NT25L55-PR | Semtech Corporation | IC AMP TIA BARE DIE | Inquiry |
|
NT25L59-WP | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Inquiry |
|
NT25L55-DTF8SR | Semtech Corporation | IC AMP TIA BARE DIE | Inquiry |
|
NT25L91-QFN-TR | Semtech Corporation | IC TXRX LDD&LA 2.5GBPS 28QFN | Inquiry |
|
NT25L51-GRP6 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Inquiry |
|
NT25L59-DTF8S | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers