BYCHIPS is the stocking distributor for NOME337M006R0023, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NOME337M006R0023 by email, we will give you a best price according your plan.
Buy NOME337M006R0023 with BYCHPS
Buy with guarantee
NOME337M006R0023
- Part Number:
- NOME337M006R0023
- Manufacturer:
- AVX Corporation
- Description:
- CAP NIOB OXI 330UF 20% 6.3V 2917
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13418 Pieces
- Data sheet:
- NOME337M006R0023.pdf
Introduction
Specifications
| Voltage - Rated: | 6.3V |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | 2917 (7343 Metric) |
| Size / Dimension: | 0.287" L x 0.169" W (7.30mm x 4.30mm) |
| Series: | OxiCap® NOM |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 2917 (7343 Metric) |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 25 Weeks |
| Manufacturer Size Code: | E |
| Manufacturer Part Number: | NOME337M006R0023 |
| Height - Seated (Max): | 0.169" (4.30mm) |
| Features: | Low ESR Multi-anode |
| Expanded Description: | 330µF Niobium Oxide Capacitor 6.3V 2917 (7343 Metric) 23 mOhm ESR |
| ESR (Equivalent Series Resistance): | 23 mOhm |
| Dissipation Factor: | 6% |
| Description: | CAP NIOB OXI 330UF 20% 6.3V 2917 |
| Current - Leakage: | 39.6µA |
| Capacitance: | 330µF |
| Email: | [email protected] |
Related parts for NOME337M006R0023
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
NOME337M004R0035 | AVX Corporation | CAP NIOB OXIDE 330UF 20% 4V 2917 | Inquiry |
|
NOME337M006S0023 | AVX Corporation | CAP NIOB OXI 330UF 20% 6.3V 2917 | Inquiry |
|
NOME337M006R0035 | AVX Corporation | CAP NIOB OXI 330UF 20% 6.3V 2917 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers