BYCHIPS is the stocking distributor for NE1619DS,118, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NE1619DS,118 by email, we will give you a best price according your plan.
Buy NE1619DS,118 with BYCHPS
Buy with guarantee
NE1619DS,118
- Part Number:
- NE1619DS,118
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC TEMP MONITOR 16SSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 17737 Pieces
- Data sheet:
- NE1619DS,118.pdf
Introduction
Specifications
| Voltage - Supply: | 2.8 V ~ 5.5 V |
|---|---|
| Topology: | ADC, Multiplexer, Register Bank |
| Supplier Device Package: | 16-SSOP |
| Series: | - |
| Sensor Type: | Internal and External |
| Sensing Temperature: | 0°C ~ 125°C, External Sensor |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 16-SSOP (0.154", 3.90mm Width) |
| Output Type: | SMBus |
| Output Fan: | No |
| Output Alarm: | Yes |
| Other Names: | 935264532118 NE1619DS-T NE1619DS-T-ND |
| Operating Temperature: | 0°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | NE1619DS,118 |
| Function: | Temp Monitoring System (Sensor) |
| Expanded Description: | Temp Monitoring System (Sensor) 0°C ~ 125°C, External Sensor Internal and External Sensor SMBus Output 16-SSOP |
| Description: | IC TEMP MONITOR 16SSOP |
| Accuracy: | ±3°C Local(Max), ±5°C Remote(Max) |
| Email: | [email protected] |
Related parts for NE1619DS,118
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
ADT7470ARQZ | Analog Devices Inc. | IC SENSOR TEMP FAN CTRLR 16QSOP | Inquiry |
|
LM96194CISQX | Texas Instruments | IC TRUTHERM HDWR MONITOR 48WQFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers