BYCHIPS is the stocking distributor for NCV7718BDQR2G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for NCV7718BDQR2G by email, we will give you a best price according your plan.
Buy NCV7718BDQR2G with BYCHPS
Buy with guarantee
NCV7718BDQR2G
- Part Number:
- NCV7718BDQR2G
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- IC DRIVER HALF BRIDGE HEX 24SSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19414 Pieces
- Data sheet:
- NCV7718BDQR2G.pdf
Introduction
Specifications
| Voltage - Supply: | 3.15 V ~ 5.25 V |
|---|---|
| Voltage - Load: | 5.5 V ~ 28 V |
| Technology: | Power MOSFET |
| Supplier Device Package: | 24-SSOP-NB-EP |
| Step Resolution: | - |
| Series: | Automotive, AEC-Q100 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 24-LSSOP (0.154", 3.90mm Width) Exposed Pad |
| Output Configuration: | Half Bridge (6) |
| Other Names: | NCV7718BDQR2GOSTR |
| Operating Temperature: | -40°C ~ 125°C (TJ) |
| Mounting Type: | Surface Mount |
| Motor Type - Stepper: | - |
| Motor Type - AC, DC: | Brushed DC |
| Moisture Sensitivity Level (MSL): | 2 (1 Year) |
| Manufacturer Standard Lead Time: | 26 Weeks |
| Manufacturer Part Number: | NCV7718BDQR2G |
| Interface: | SPI |
| Function: | Driver - Fully Integrated, Control and Power Stage |
| Expanded Description: | Motor Driver Power MOSFET SPI 24-SSOP-NB-EP |
| Description: | IC DRIVER HALF BRIDGE HEX 24SSOP |
| Current - Output: | 550mA |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for NCV7718BDQR2G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers