BYCHIPS is the stocking distributor for MX29GL320EHT2I-70G, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MX29GL320EHT2I-70G by email, we will give you a best price according your plan.
Buy MX29GL320EHT2I-70G with BYCHPS
Buy with guarantee
MX29GL320EHT2I-70G
- Part Number:
- MX29GL320EHT2I-70G
- Manufacturer:
- Macronix
- Description:
- IC FLASH 32MBIT 70NS 56TSOP
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14327 Pieces
- Data sheet:
- MX29GL320EHT2I-70G.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 56-TSOP |
| Speed: | 70ns |
| Series: | MX29GL |
| Packaging: | Tray |
| Package / Case: | 56-TFSOP (0.724", 18.40mm Width) |
| Other Names: | 1092-1102 6666H-56TB70IYEX99 6666H-56TB70IYEX9W MX29GL320EHT2I70G |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Non-Volatile |
| Memory Size: | 32Mb (4M x 8) |
| Memory Format: | FLASH |
| Manufacturer Standard Lead Time: | 16 Weeks |
| Manufacturer Part Number: | MX29GL320EHT2I-70G |
| Interface: | Parallel |
| Description: | IC FLASH 32MBIT 70NS 56TSOP |
| Email: | [email protected] |
Related parts for MX29GL320EHT2I-70G
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MX29GL320ELT2I-70G | Macronix | IC FLASH 32MBIT 70NS 56TSOP | Inquiry |
 |
MX29GL320ETXEI-70G | Macronix | IC FLASH 32MBIT 70NS 48LFBGA | Inquiry |
 |
MX29GL320EHXFI-70G | Macronix | IC FLASH 32MBIT 70NS 64LFBGA | Inquiry |
|
MX29GL320EBXEI-70G | Macronix | IC FLASH 32MBIT 70NS 48LFBGA | Inquiry |
 |
MX29GL320ETTI-70G | Macronix | IC FLASH 32MBIT 70NS 48TSOP | Inquiry |
|
MX29GL320EBTI-70G | Macronix | IC FLASH 32MBIT 70NS 48TSOP | Inquiry |
|
MX29GL320ELXFI-70G | Macronix | IC FLASH 32MBIT 70NS 64LFBGA | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers