BYCHIPS is the stocking distributor for MS1008, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MS1008 by email, we will give you a best price according your plan.
Buy MS1008 with BYCHPS
Buy with guarantee
MS1008
- Part Number:
- MS1008
- Manufacturer:
- Microsemi
- Description:
- TRANS RF BIPO 233W 10A TO-220AC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18984 Pieces
- Data sheet:
- MS1008.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 55V |
|---|---|
| Transistor Type: | NPN |
| Supplier Device Package: | M164 |
| Series: | - |
| Power - Max: | 233W |
| Packaging: | Bulk |
| Package / Case: | M164 |
| Operating Temperature: | 200°C (TJ) |
| Noise Figure (dB Typ @ f): | - |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MS1008 |
| Gain: | 14dB |
| Frequency - Transition: | 30MHz |
| Expanded Description: | RF Transistor NPN 55V 10A 30MHz 233W Chassis Mount M164 |
| Description: | TRANS RF BIPO 233W 10A TO-220AC |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 15 @ 1.4A, 6V |
| Current - Collector (Ic) (Max): | 10A |
| Email: | [email protected] |
Related parts for MS1008
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BFP405FH6327XTSA1 | Infineon Technologies | TRANS RF NPN 4.5V 25MA TSFP-4 | Inquiry |
 |
MS1003 | Microsemi Corporation | TRANS RF BIPO 270W 20A TO-220AC | Inquiry |
 |
BFR 183T E6327 | Infineon Technologies | TRANSISTOR RF NPN 12V SC-75 | Inquiry |
|
MS1001 | Microsemi Corporation | TRANS RF BIPO 270W 20A M174 | Inquiry |
|
MS1004 | Microsemi Corporation | TRANS RF BIPO 270W 20A TO-220AC | Inquiry |
|
MS1007 | Microsemi Corporation | TRANS RF BIPO 233W 10A M174 | Inquiry |
 |
BFU520XRVL | NXP USA Inc. | TRANS RF NPN 12V 30MA SOT-143R | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers