BYCHIPS is the stocking distributor for MRF327, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MRF327 by email, we will give you a best price according your plan.
Buy MRF327 with BYCHPS
Buy with guarantee
MRF327
- Part Number:
- MRF327
- Manufacturer:
- Aeroflex (MACOM Technology Solutions)
- Description:
- TRANS RF NPN 33V 9A 316-01
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14450 Pieces
- Data sheet:
- MRF327.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 33V |
|---|---|
| Transistor Type: | NPN |
| Supplier Device Package: | 316-01, STYLE 1 |
| Series: | - |
| Power - Max: | 80W |
| Packaging: | Tray |
| Package / Case: | 316-01 |
| Other Names: | 1465-1181 |
| Operating Temperature: | - |
| Noise Figure (dB Typ @ f): | - |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MRF327 |
| Gain: | 9dB |
| Frequency - Transition: | - |
| Expanded Description: | RF Transistor NPN 33V 9A 80W Chassis Mount 316-01, STYLE 1 |
| Description: | TRANS RF NPN 33V 9A 316-01 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 4A, 5V |
| Current - Collector (Ic) (Max): | 9A |
| Email: | [email protected] |
Related parts for MRF327
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
BFP 720F E6327 | Infineon Technologies | TRANS RF NPN 45GHZ 4.7V TSFP4 | Inquiry |
 |
MRF323 | M/A-Com Technology Solutions | TRANS RF NPN 33V 1.1A 244-04 | Inquiry |
 |
PN5179_D27Z | Fairchild/ON Semiconductor | TRANS RF NPN 12V 50MA TO-92 | Inquiry |
|
MRF321 | M/A-Com Technology Solutions | TRANS RF NPN 33V 1.1A 244-04 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers