BYCHIPS is the stocking distributor for MR25H256MDC, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MR25H256MDC by email, we will give you a best price according your plan.
Buy MR25H256MDC with BYCHPS
Buy with guarantee
MR25H256MDC
- Part Number:
- MR25H256MDC
- Manufacturer:
- EverSpin Technologies, Inc.
- Description:
- IC MRAM 256KBIT 40MHZ 8DFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14950 Pieces
- Data sheet:
- MR25H256MDC.pdf
Introduction
Specifications
| Voltage - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Supplier Device Package: | 8-DFN-EP, Large Flag (5x6) |
| Speed: | 40MHz |
| Series: | Automotive, AEC-Q100 |
| Packaging: | Tray |
| Package / Case: | 8-TDFN Exposed Pad |
| Other Names: | 819-1048 MR25H256MDC-ND |
| Operating Temperature: | -40°C ~ 125°C (TA) |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Memory Type: | Non-Volatile |
| Memory Size: | 256Kb (32K x 8) |
| Memory Format: | RAM |
| Manufacturer Standard Lead Time: | 14 Weeks |
| Manufacturer Part Number: | MR25H256MDC |
| Interface: | SPI Serial |
| Description: | IC MRAM 256KBIT 40MHZ 8DFN |
| Email: | [email protected] |
Related parts for MR25H256MDC
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MR25H256MDF | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
 |
MR25H256CDCR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
|
MR25H256CDFR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
|
MR25H256MDCR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
|
MR25H256MDFR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
|
MR25H256CDC | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
|
MR25H256CDF | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers