BYCHIPS is the stocking distributor for MLG1608B3N9STD25, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MLG1608B3N9STD25 by email, we will give you a best price according your plan.
Buy MLG1608B3N9STD25 with BYCHPS
Buy with guarantee
MLG1608B3N9STD25
- Part Number:
- MLG1608B3N9STD25
- Manufacturer:
- TDK Corporation
- Description:
- FIXED IND 3.9NH 600MA 140 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14404 Pieces
- Data sheet:
- MLG1608B3N9STD25.pdf
Introduction
Specifications
| Type: | Multilayer |
|---|---|
| Tolerance: | ±0.3nH |
| Supplier Device Package: | 0603 (1608 Metric) |
| Size / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Shielding: | Unshielded |
| Series: | MLG |
| Ratings: | AEC-Q200 |
| Q @ Freq: | 10 @ 100MHz |
| Packaging: | Cut Tape (CT) |
| Package / Case: | 0603 (1608 Metric) |
| Other Names: | 445-16353-1 |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Non-Magnetic |
| Manufacturer Part Number: | MLG1608B3N9STD25 |
| Inductance: | 3.9nH |
| Height - Seated (Max): | 0.037" (0.95mm) |
| Frequency - Test: | 100MHz |
| Frequency - Self Resonant: | 6GHz |
| Expanded Description: | 3.9nH Unshielded Multilayer Inductor 600mA 140 mOhm Max 0603 (1608 Metric) |
| Description: | FIXED IND 3.9NH 600MA 140 MOHM |
| DC Resistance (DCR): | 140 mOhm Max |
| Current Rating: | 600mA |
| Current - Saturation: | - |
| Email: | [email protected] |
Related parts for MLG1608B3N9STD25
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers