BYCHIPS is the stocking distributor for MIO600-65E11, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MIO600-65E11 by email, we will give you a best price according your plan.
Buy MIO600-65E11 with BYCHPS
Buy with guarantee
MIO600-65E11
- Part Number:
- MIO600-65E11
- Manufacturer:
- IXYS Corporation
- Description:
- IGBT MODULE SGL 600A E11
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13937 Pieces
- Data sheet:
- MIO600-65E11.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 6500V |
|---|---|
| Vce(on) (Max) @ Vge, Ic: | 4.2V @ 15V, 600A |
| Supplier Device Package: | E11 |
| Series: | - |
| Power - Max: | - |
| Package / Case: | E11 |
| Operating Temperature: | -40°C ~ 125°C (TJ) |
| NTC Thermistor: | No |
| Mounting Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MIO600-65E11 |
| Input Capacitance (Cies) @ Vce: | 150nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Expanded Description: | IGBT Module NPT Single Switch 6500V 600A Chassis Mount E11 |
| Description: | IGBT MODULE SGL 600A E11 |
| Current - Collector Cutoff (Max): | 120mA |
| Current - Collector (Ic) (Max): | 600A |
| Configuration: | Single Switch |
| Email: | [email protected] |
Related parts for MIO600-65E11
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
APTGF250SK60D3G | Microsemi Corporation | IGBT 600V 400A 1250W D3 | Inquiry |
 |
CM400DY-34A | Powerex Inc. | IGBT MODULE DUAL 400A 1700V | Inquiry |
|
APTGT150TDU60PG | Microsemi Corporation | IGBT MODULE TRPL DUAL SRCE SP6P | Inquiry |
|
APTGT300DA170D3G | Microsemi Corporation | IGBT 1700V 530A 1470W D3 | Inquiry |
|
CM200DU-24NFH | Powerex Inc. | IGBT MOD DUAL 1200V 200A NFH SER | Inquiry |
|
APTGV100H60BTPG | Microsemi Corporation | IGBT NPT BST CHOP FULL BRDG SP6P | Inquiry |
 |
MUBW75-12T8 | IXYS | MODULE IGBT CBI E3 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers