BYCHIPS is the stocking distributor for MGV0603R47M-10, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MGV0603R47M-10 by email, we will give you a best price according your plan.
Buy MGV0603R47M-10 with BYCHPS
Buy with guarantee
MGV0603R47M-10
- Part Number:
- MGV0603R47M-10
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Description:
- FIXED IND 470NH 17.5A 4.2 MOHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 14232 Pieces
- Data sheet:
- 1.MGV0603R47M-10.pdf2.MGV0603R47M-10.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | - |
| Size / Dimension: | 0.287" L x 0.264" W (7.30mm x 6.70mm) |
| Shielding: | Shielded |
| Series: | MGV |
| Ratings: | - |
| Q @ Freq: | - |
| Packaging: | Original-Reel® |
| Package / Case: | Nonstandard |
| Other Names: | 240-2905-6 |
| Operating Temperature: | -40°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | - |
| Manufacturer Standard Lead Time: | 10 Weeks |
| Manufacturer Part Number: | MGV0603R47M-10 |
| Inductance: | 470nH |
| Height - Seated (Max): | 0.130" (3.30mm) |
| Frequency - Test: | 100kHz |
| Frequency - Self Resonant: | - |
| Expanded Description: | 470nH Shielded Wirewound Inductor 17.5A 4.2 mOhm Max Nonstandard |
| Description: | FIXED IND 470NH 17.5A 4.2 MOHM |
| DC Resistance (DCR): | 4.2 mOhm Max |
| Current Rating: | 17.5A |
| Current - Saturation: | 26A |
| Email: | [email protected] |
Related parts for MGV0603R47M-10
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers