BYCHIPS is the stocking distributor for MCR18EZHF7320, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MCR18EZHF7320 by email, we will give you a best price according your plan.
Buy MCR18EZHF7320 with BYCHPS
Buy with guarantee
MCR18EZHF7320
- Part Number:
- MCR18EZHF7320
- Manufacturer:
- LAPIS Semiconductor
- Description:
- RES SMD 732 OHM 1% 1/4W 1206
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13299 Pieces
- Data sheet:
- MCR18EZHF7320.pdf
Introduction
Specifications
| Tolerance: | ±1% |
|---|---|
| Temperature Coefficient: | ±100ppm/°C |
| Supplier Device Package: | 1206 |
| Size / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Series: | MCR |
| Resistance (Ohms): | 732 |
| Power (Watts): | 0.25W, 1/4W |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1206 (3216 Metric) |
| Other Names: | RHM732FTR |
| Operating Temperature: | -55°C ~ 155°C |
| Number of Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MCR18EZHF7320 |
| Height - Seated (Max): | 0.026" (0.65mm) |
| Features: | - |
| Failure Rate: | - |
| Expanded Description: | 732 Ohm ±1% 0.25W, 1/4W Chip Resistor 1206 (3216 Metric) Thick Film |
| Description: | RES SMD 732 OHM 1% 1/4W 1206 |
| Composition: | Thick Film |
| Email: | [email protected] |
Related parts for MCR18EZHF7320
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers