BYCHIPS is the stocking distributor for MCH155A1R3CK, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MCH155A1R3CK by email, we will give you a best price according your plan.
Buy MCH155A1R3CK with BYCHPS
Buy with guarantee
MCH155A1R3CK
- Part Number:
- MCH155A1R3CK
- Manufacturer:
- LAPIS Semiconductor
- Description:
- CAP CER 1.3PF 50V C0G/NP0 0402
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13462 Pieces
- Data sheet:
- MCH155A1R3CK.pdf
Introduction
Specifications
| Voltage - Rated: | 50V |
|---|---|
| Tolerance: | ±0.25pF |
| Thickness (Max): | - |
| Temperature Coefficient: | C0G, NP0 |
| Size / Dimension: | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Series: | - |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0402 (1005 Metric) |
| Other Names: | 511-1005-2 |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount, MLCC |
| Manufacturer Part Number: | MCH155A1R3CK |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.022" (0.55mm) |
| Features: | - |
| Expanded Description: | 1.3pF ±0.25pF 50V Ceramic Capacitor C0G, NP0 0402 (1005 Metric) |
| Description: | CAP CER 1.3PF 50V C0G/NP0 0402 |
| Capacitance: | 1.3pF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for MCH155A1R3CK
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers