BYCHIPS is the stocking distributor for MC145574ADW, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MC145574ADW by email, we will give you a best price according your plan.
Buy MC145574ADW with BYCHPS
Buy with guarantee
MC145574ADW
- Part Number:
- MC145574ADW
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC TRANSCEIVER ISDN 28-SOIC
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 16670 Pieces
- Data sheet:
- MC145574ADW.pdf
Introduction
Specifications
| Voltage - Supply: | 4.75 V ~ 5.25 V |
|---|---|
| Type: | Transceiver |
| Supplier Device Package: | 28-SOIC |
| Series: | - |
| Protocol: | - |
| Packaging: | Tube |
| Package / Case: | 28-SOIC (0.295", 7.50mm Width) |
| Operating Temperature: | - |
| Number of Drivers/Receivers: | - |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | MC145574ADW |
| Expanded Description: | Transceiver 28-SOIC |
| Duplex: | - |
| Description: | IC TRANSCEIVER ISDN 28-SOIC |
| Data Rate: | - |
| Email: | [email protected] |
Related parts for MC145574ADW
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MC145574ADWR2 | NXP USA Inc. | IC TRANSCEIVER ISDN 28-SOIC | Inquiry |
 |
MC145574AACR2 | NXP USA Inc. | IC TRANSCEIVER ISDN 32-LQFP | Inquiry |
 |
MC145572AAC | NXP USA Inc. | IC TRANSCEIVER ISDN 44-LQFP | Inquiry |
|
MC145574AAC | NXP USA Inc. | IC TRANSCEIVER ISDN 32-LQFP | Inquiry |
|
MC145572APB | NXP USA Inc. | IC ISDN INTERFACE TXCVER 44-LQFP | Inquiry |
|
MC145572AFN | NXP USA Inc. | IC TRANSCEIVER ISDN 44-PLCC | Inquiry |
|
MC145483DW | NXP USA Inc. | IC CODEC-FILTER PCM 3V 20-SOIC | Inquiry |
|
MC145574APB | NXP USA Inc. | IC TRANSCEIVER ISDN 32-LQFP | Inquiry |
 |
MC145012EGR2 | NXP USA Inc. | IC SMOKE DETECT PHOTOELEC 16SOIC | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers