BYCHIPS is the stocking distributor for MC100LVEP11MNR4, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MC100LVEP11MNR4 by email, we will give you a best price according your plan.
Buy MC100LVEP11MNR4 with BYCHPS
Buy with guarantee
MC100LVEP11MNR4
- Part Number:
- MC100LVEP11MNR4
- Manufacturer:
- AMI Semiconductor / ON Semiconductor
- Description:
- IC CLK BUFFER 1:2 3GHZ 8DFN
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 18872 Pieces
- Data sheet:
- MC100LVEP11MNR4.pdf
Introduction
Specifications
| Voltage - Supply: | 2.375 V ~ 3.8 V |
|---|---|
| Type: | Fanout Buffer (Distribution) |
| Supplier Device Package: | 8-DFN (2x2) |
| Series: | 100LVEP |
| Ratio - Input:Output: | 1:2 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 8-VFDFN Exposed Pad |
| Output: | ECL, PECL |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | MC100LVEP11MNR4 |
| Input: | CML, LVDS, PECL |
| Frequency - Max: | 3GHz |
| Expanded Description: | Clock Fanout Buffer (Distribution) IC 3GHz 8-VFDFN Exposed Pad |
| Differential - Input:Output: | Yes/Yes |
| Description: | IC CLK BUFFER 1:2 3GHZ 8DFN |
| Email: | [email protected] |
Related parts for MC100LVEP11MNR4
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers