BYCHIPS is the stocking distributor for MC100ES6535DT, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MC100ES6535DT by email, we will give you a best price according your plan.
Buy MC100ES6535DT with BYCHPS
Buy with guarantee
MC100ES6535DT
- Part Number:
- MC100ES6535DT
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- IC CLK BUFFER 2:4 1GHZ 20TSSOP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12328 Pieces
- Data sheet:
- MC100ES6535DT.pdf
Introduction
Specifications
| Voltage - Supply: | 3.135 V ~ 3.8 V |
|---|---|
| Type: | Fanout Buffer (Distribution), Multiplexer |
| Supplier Device Package: | 20-TSSOP |
| Series: | 100ES |
| Ratio - Input:Output: | 2:4 |
| Packaging: | Tube |
| Package / Case: | 20-TSSOP (0.173", 4.40mm Width) |
| Output: | LVPECL |
| Operating Temperature: | -40°C ~ 85°C |
| Number of Circuits: | 1 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MC100ES6535DT |
| Input: | LVCMOS, LVTTL |
| Frequency - Max: | 1GHz |
| Expanded Description: | Clock Fanout Buffer (Distribution), Multiplexer IC 1GHz 20-TSSOP (0.173", 4.40mm Width) |
| Differential - Input:Output: | No/Yes |
| Description: | IC CLK BUFFER 2:4 1GHZ 20TSSOP |
| Email: | [email protected] |
Related parts for MC100ES6535DT
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MC100ES6226AC | NXP USA Inc. | IC CLK BUFFER 1:9 3GHZ 32LQFP | Inquiry |
 |
MC100ES6210FA | NXP USA Inc. | IC CLK BUFFER 1:5 3GHZ 32LQFP | Inquiry |
|
MC100ES6254AC | NXP USA Inc. | IC CLK BUFFER 2:3 3GHZ 32LQFP | Inquiry |
|
MC100ES6139DT | NXP USA Inc. | IC CLOCK GENERATION CHIP 20TSSOP | Inquiry |
|
MC100ES6130DT | NXP USA Inc. | IC CLK BUFFER 2:4 2.5GHZ 16TSSOP | Inquiry |
|
MC100ES6039DW | NXP USA Inc. | IC CLOCK GENERATION CHIP 20-SOIC | Inquiry |
|
MC100ES6056DT | NXP USA Inc. | IC CLK BUFFER 2:1 3GHZ 20TSSOP | Inquiry |
|
MC100ES60T22D | NXP USA Inc. | IC DUAL TRANSLATOR 3.3V 8-SOIC | Inquiry |
|
MC100ES6226FA | NXP USA Inc. | IC CLK BUFFER 1:9 3GHZ 32LQFP | Inquiry |
|
MC100ES6011D | NXP USA Inc. | IC CLK BUFFER 1:2 3GHZ 8SOIC | Inquiry |
|
MC100ES6254FA | NXP USA Inc. | IC CLK BUFFER 2:3 3GHZ 32LQFP | Inquiry |
|
MC100ES6111AC | NXP USA Inc. | IC CLK BUFFER 2:10 2.7GHZ 32LQFP | Inquiry |
|
MC100ES6220TB | NXP USA Inc. | IC CLK BUFFER 1:10 1GHZ 52LQFP | Inquiry |
|
MC100ES6210AC | NXP USA Inc. | IC CLK BUFFER 1:5 3GHZ 32LQFP | Inquiry |
|
MC100ES6221TB | NXP USA Inc. | IC CLK BUFFER 2:20 2GHZ 52LQFP | Inquiry |
|
MC100ES6222TB | NXP USA Inc. | IC CLK BUFFER 2:15 3GHZ 52LQFP | Inquiry |
|
MC100ES6014DT | NXP USA Inc. | IC CLK BUFFER 2:5 2GHZ 20TSSOP | Inquiry |
|
MC100ES6111FA | NXP USA Inc. | IC CLK BUFFER 2:10 2.7GHZ 32LQFP | Inquiry |
|
MC100ES6111FAR2 | NXP USA Inc. | IC CLK BUFFER 2:10 2.7GHZ 32LQFP | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers