BYCHIPS is the stocking distributor for MAX8672ETD+T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAX8672ETD+T by email, we will give you a best price according your plan.
Buy MAX8672ETD+T with BYCHPS
Buy with guarantee
MAX8672ETD+T
- Part Number:
- MAX8672ETD+T
- Manufacturer:
- Maxim Integrated
- Description:
- IC MANAGE NIMH BACKUP 14-TDFN
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 16407 Pieces
- Data sheet:
- 1.MAX8672ETD+T.pdf2.MAX8672ETD+T.pdf
Introduction
Specifications
| Supplier Device Package: | 14-TDFN-EP (3x3) |
|---|---|
| Series: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 14-WFDFN Exposed Pad |
| Operating Temperature: | -40°C ~ 85°C (TA) |
| Number of Cells: | 1 ~ 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 6 Weeks |
| Manufacturer Part Number: | MAX8672ETD+T |
| Interface: | - |
| Function: | Power Management |
| Fault Protection: | Reverse Current |
| Expanded Description: | Battery Power Management IC Nickel Metal Hydride 14-TDFN-EP (3x3) |
| Description: | IC MANAGE NIMH BACKUP 14-TDFN |
| Battery Chemistry: | Nickel Metal Hydride |
| Email: | [email protected] |
Related parts for MAX8672ETD+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers