BYCHIPS is the stocking distributor for MAX5700ATB+T, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAX5700ATB+T by email, we will give you a best price according your plan.
Buy MAX5700ATB+T with BYCHPS
Buy with guarantee
MAX5700ATB+T
- Part Number:
- MAX5700ATB+T
- Manufacturer:
- Maxim Integrated
- Description:
- IC DAC
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 19390 Pieces
- Data sheet:
- 1.MAX5700ATB+T.pdf2.MAX5700ATB+T.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | 2.7 V ~ 5.5 V |
|---|---|
| Voltage - Supply, Analog: | 2.7 V ~ 5.5 V |
| Supplier Device Package: | 10-TDFN-EP (3x3) |
| Settling Time: | 2.2µs (Typ) |
| Series: | - |
| Reference Type: | External, Internal |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 10-WFDFN Exposed Pad |
| Output Type: | Voltage - Buffered |
| Operating Temperature: | -40°C ~ 125°C |
| Number of D/A Converters: | 2 |
| Number of Bits: | 8 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 18 Weeks |
| Manufacturer Part Number: | MAX5700ATB+T |
| INL/DNL (LSB): | ±0.05, ±0.05 |
| Expanded Description: | 8 Bit Digital to Analog Converter 2 10-TDFN-EP (3x3) |
| Differential Output: | No |
| Description: | IC DAC |
| Data Interface: | SPI, DSP |
| Architecture: | - |
| Email: | [email protected] |
Related parts for MAX5700ATB+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers