BYCHIPS is the stocking distributor for MAX507BCWG, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAX507BCWG by email, we will give you a best price according your plan.
Buy MAX507BCWG with BYCHPS
Buy with guarantee
MAX507BCWG
- Part Number:
- MAX507BCWG
- Manufacturer:
- Maxim Integrated
- Description:
- IC DAC V-OUT W/REF 12BIT 24-SOIC
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12352 Pieces
- Data sheet:
- 1.MAX507BCWG.pdf2.MAX507BCWG.pdf
Introduction
Specifications
| Voltage - Supply, Digital: | 11.4 V ~ 15.75 V |
|---|---|
| Voltage - Supply, Analog: | ±11.4 V ~ 15.75 V |
| Supplier Device Package: | 24-SOIC |
| Settling Time: | 5µs |
| Series: | - |
| Reference Type: | Internal |
| Packaging: | Tube |
| Package / Case: | 24-SOIC (0.295", 7.50mm Width) |
| Output Type: | Voltage - Buffered |
| Operating Temperature: | 0°C ~ 70°C |
| Number of D/A Converters: | 1 |
| Number of Bits: | 12 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MAX507BCWG |
| INL/DNL (LSB): | ±1 (Max), ±1 (Max) |
| Expanded Description: | 12 Bit Digital to Analog Converter 1 24-SOIC |
| Differential Output: | No |
| Description: | IC DAC V-OUT W/REF 12BIT 24-SOIC |
| Data Interface: | Parallel |
| Architecture: | R-2R |
| Email: | [email protected] |
Related parts for MAX507BCWG
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers