BYCHIPS is the stocking distributor for MAT03EH, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAT03EH by email, we will give you a best price according your plan.
Buy MAT03EH with BYCHPS
Buy with guarantee
MAT03EH
- Part Number:
- MAT03EH
- Manufacturer:
- AD
- Description:
- TRANS 2PNP 36V 0.02A TO78-6
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 19059 Pieces
- Data sheet:
- MAT03EH.pdf
Introduction
Specifications
| Voltage - Collector Emitter Breakdown (Max): | 36V |
|---|---|
| Vce Saturation (Max) @ Ib, Ic: | 100mV @ 100µA, 1mA |
| Transistor Type: | 2 PNP (Dual) |
| Supplier Device Package: | TO-78-6 |
| Series: | - |
| Power - Max: | 500mW |
| Packaging: | Tube |
| Package / Case: | TO-78-6 Metal Can |
| Operating Temperature: | -55°C ~ 150°C (TJ) |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | MAT03EH |
| Frequency - Transition: | 190MHz |
| Expanded Description: | Bipolar (BJT) Transistor Array 2 PNP (Dual) 36V 20mA 190MHz 500mW Through Hole TO-78-6 |
| Description: | TRANS 2PNP 36V 0.02A TO78-6 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | - |
| Current - Collector Cutoff (Max): | - |
| Current - Collector (Ic) (Max): | 20mA |
| Email: | [email protected] |
Related parts for MAT03EH
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MAT03FHZ | Analog Devices Inc. | TRANS 2PNP 36V 0.02A TO78-6 | Inquiry |
 |
STA460C | Sanken | TRANS 2NPN DARL 60V 6A | Inquiry |
 |
XP0250100L | Panasonic Electronic Components | TRANS 2NPN 50V 0.1A SMINI5 | Inquiry |
|
MAT03FH | Analog Devices Inc. | TRANS 2PNP 36V 0.02A TO78-6 | Inquiry |
|
MAT03EHZ | Analog Devices Inc. | TRANS 2PNP 36V 0.02A TO78-6 | Inquiry |
 |
ZDT6753TA | Diodes Incorporated | TRANS NPN/PNP 100V 2A SM8 | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers