BYCHIPS is the stocking distributor for MAL202139229E3, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MAL202139229E3 by email, we will give you a best price according your plan.
Buy MAL202139229E3 with BYCHPS
Buy with guarantee
MAL202139229E3
- Part Number:
- MAL202139229E3
- Manufacturer:
- Angstrohm / Vishay
- Description:
- CAP ALUM 22UF 20% 100V AXIAL
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13085 Pieces
- Data sheet:
- MAL202139229E3.pdf
Introduction
Specifications
| Voltage Rating: | 100V |
|---|---|
| Tolerance: | ±20% |
| Surface Mount Land Size: | - |
| Size / Dimension: | 0.256" Dia x 0.709" L (6.50mm x 18.00mm) |
| Series: | ASM 021 |
| Ripple Current: | 100mA |
| Polarization: | Polar |
| Packaging: | Tape & Box (TB) |
| Package / Case: | Axial, Can |
| Other Names: | 2222 021 39229 222202139229 4091PHTB MAL202139229 |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 9 Weeks |
| Manufacturer Part Number: | MAL202139229E3 |
| Lifetime @ Temp.: | 2500 Hrs @ 85°C |
| Lead Spacing: | - |
| Impedance: | 4.1 Ohm |
| Height - Seated (Max): | - |
| Expanded Description: | 22µF 100V Aluminum Capacitors Axial, Can 5.8 Ohm 2500 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 5.8 Ohm |
| Description: | CAP ALUM 22UF 20% 100V AXIAL |
| Capacitance: | 22µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for MAL202139229E3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers