BYCHIPS is the stocking distributor for MA4P161-134, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for MA4P161-134 by email, we will give you a best price according your plan.
Buy MA4P161-134 with BYCHPS
Buy with guarantee
MA4P161-134
- Part Number:
- MA4P161-134
- Manufacturer:
- Aeroflex (MACOM Technology Solutions)
- Description:
- DIODE PIN CHIP OXIDE
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 13945 Pieces
- Data sheet:
- MA4P161-134.pdf
Introduction
Specifications
| Voltage - Peak Reverse (Max): | 100V |
|---|---|
| Supplier Device Package: | Die |
| Series: | - |
| Resistance @ If, F: | 1.5 Ohm @ 10mA, 500MHz |
| Power Dissipation (Max): | - |
| Packaging: | Bulk |
| Package / Case: | Die |
| Other Names: | 1465-1036 |
| Operating Temperature: | 175°C (TJ) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 8 Weeks |
| Manufacturer Part Number: | MA4P161-134 |
| Expanded Description: | RF Diode PIN - Single 100V Die |
| Diode Type: | PIN - Single |
| Description: | DIODE PIN CHIP OXIDE |
| Current - Max: | - |
| Capacitance @ Vr, F: | 0.1pF @ 50V, 1MHz |
| Email: | [email protected] |
Related parts for MA4P161-134
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
MA4P1450-1091T | M/A-Com Technology Solutions | DIODE PIN CERAMIC SI | Inquiry |
 |
BA982-GS08 | Vishay Semiconductor Diodes Division | DIODE BAND SW SOD80 | Inquiry |
 |
MA4P1200NM-401T | M/A-Com Technology Solutions | NON MAGNETIC AXIAL LEAD CERAMIC | Inquiry |
|
MA4P1250-1072T | M/A-Com Technology Solutions | DIODE PIN SMQ CERAMIC SI | Inquiry |
|
MA4P1250NM-1072T | M/A-Com Technology Solutions | NON-MAGNETIC PIN MELF | Inquiry |
 |
SMP1331-087LF | Skyworks Solutions Inc. | SHUNT SERIES CONNECTED PIN DIODE | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers