BYCHIPS is the stocking distributor for M5475EFE, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for M5475EFE by email, we will give you a best price according your plan.
Buy M5475EFE with BYCHPS
Buy with guarantee
M5475EFE
- Part Number:
- M5475EFE
- Manufacturer:
- NXP Semiconductors / Freescale
- Description:
- MODULE FIRE ENGINE
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12969 Pieces
- Data sheet:
- M5475EFE.pdf
Introduction
Specifications
| Speed: | 266MHz |
|---|---|
| Size / Dimension: | 3.7" x 4.5" (93.4mm x 114.3mm) |
| Series: | ColdFire® |
| RAM Size: | 64MB |
| Operating Temperature: | 0°C ~ 70°C |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Module/Board Type: | MPU Core |
| Manufacturer Part Number: | M5475EFE |
| Flash Size: | 2MB (Boot) |
| Expanded Description: | ColdFire® Embedded Module ColdFire V4e, MCF5475 266MHz 64MB 2MB (Boot) |
| Description: | MODULE FIRE ENGINE |
| Core Processor: | ColdFire V4e, MCF5475 |
| Connector Type: | - |
| Co-Processor: | - |
| Email: | [email protected] |
Related parts for M5475EFE
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
TE0720-03-2IF | Trenz Electronic GmbH | SOM ZYNQ XC7Z020-2I 1GB DDR3 | Inquiry |
 |
M5475AFE | NXP USA Inc. | MODULE FIRE ENGINE | Inquiry |
|
M5475DFE | NXP USA Inc. | MODULE FIRE ENGINE | Inquiry |
|
M5475CFE | NXP USA Inc. | MODULE FIRE ENGINE | Inquiry |
|
M5475BFE | NXP USA Inc. | MODULE FIRE ENGINE | Inquiry |
 |
FS-372 | Digi International | MODULE 32MB SDRAM 32MB FLASH | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers