BYCHIPS is the stocking distributor for LQH3NPZ330MGRL, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LQH3NPZ330MGRL by email, we will give you a best price according your plan.
Buy LQH3NPZ330MGRL with BYCHPS
Buy with guarantee
LQH3NPZ330MGRL
- Part Number:
- LQH3NPZ330MGRL
- Manufacturer:
- Murata Electronics
- Description:
- FIXED IND 33UH 600MA 1.032 OHM
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15632 Pieces
- Data sheet:
- 1.LQH3NPZ330MGRL.pdf2.LQH3NPZ330MGRL.pdf
Introduction
Specifications
| Type: | Wirewound |
|---|---|
| Tolerance: | ±20% |
| Supplier Device Package: | 1212 (3030 Metric) |
| Size / Dimension: | 0.118" L x 0.118" W (3.00mm x 3.00mm) |
| Shielding: | Shielded |
| Series: | LQH3 |
| Ratings: | AEC-Q200 |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1212 (3030 Metric) |
| Other Names: | 490-15962-2 |
| Operating Temperature: | -40°C ~ 85°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Manufacturer Standard Lead Time: | 9 Weeks |
| Manufacturer Part Number: | LQH3NPZ330MGRL |
| Inductance: | 33µH |
| Height - Seated (Max): | 0.039" (1.00mm) |
| Frequency - Test: | 1MHz |
| Frequency - Self Resonant: | 8MHz |
| Expanded Description: | 33µH Shielded Wirewound Inductor 600mA 1.032 Ohm Max 1212 (3030 Metric) |
| Description: | FIXED IND 33UH 600MA 1.032 OHM |
| DC Resistance (DCR): | 1.032 Ohm Max |
| Current Rating: | 600mA |
| Current - Saturation: | 320mA |
| Email: | [email protected] |
Related parts for LQH3NPZ330MGRL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers