BYCHIPS is the stocking distributor for LH25060PC, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LH25060PC by email, we will give you a best price according your plan.
Buy LH25060PC with BYCHPS
Buy with guarantee
LH25060PC
- Part Number:
- LH25060PC
- Manufacturer:
- Littelfuse
- Description:
- FUSE BLOCK COVER ACS 60A 250V
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 15190 Pieces
- Data sheet:
- LH25060PC.pdf
Introduction
Specifications
| Series: | - |
|---|---|
| Other Names: | LH25060-PC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Part Number: | LH25060PC |
| For Use With/Related Products: | Fuseholder; LH25060, LR25060 |
| Description: | FUSE BLOCK COVER ACS 60A 250V |
| Accessory Type: | Cap (Cover) |
| Email: | [email protected] |
Related parts for LH25060PC
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
 |
LH250603C | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250603S | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250601C | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250602CR | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250602S | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250601CR | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250602C | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250303P | Littelfuse Inc. | FUSE BLOCK CART 250V 30A CHASSIS | Inquiry |
|
LH250303PR | Littelfuse Inc. | FUSE BLOCK CART 250V 30A CHASSIS | Inquiry |
|
LH250601S | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
|
LH250603CR | Littelfuse Inc. | FUSE BLOCK CART 250V 60A CHASSIS | Inquiry |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers