BYCHIPS is the stocking distributor for LG226D224MAT2S1, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LG226D224MAT2S1 by email, we will give you a best price according your plan.
Buy LG226D224MAT2S1 with BYCHPS
Buy with guarantee
LG226D224MAT2S1
- Part Number:
- LG226D224MAT2S1
- Manufacturer:
- AVX Corporation
- Description:
- CAP CER 0.22UF 6.3V X5R 0306
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 18700 Pieces
- Data sheet:
- 1.LG226D224MAT2S1.pdf2.LG226D224MAT2S1.pdf
Introduction
Specifications
| Voltage - Rated: | 6.3V |
|---|---|
| Tolerance: | ±20% |
| Thickness (Max): | 0.022" (0.55mm) |
| Temperature Coefficient: | X5R |
| Size / Dimension: | 0.030" L x 0.063" W (0.76mm x 1.60mm) |
| Series: | LG22 (LGA) |
| Ratings: | - |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 0306 (0816 Metric) |
| Other Names: | 478-4629-2 |
| Operating Temperature: | -55°C ~ 85°C |
| Mounting Type: | Surface Mount, MLCC |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Standard Lead Time: | 15 Weeks |
| Manufacturer Part Number: | LG226D224MAT2S1 |
| Lead Style: | - |
| Lead Spacing: | - |
| Height - Seated (Max): | - |
| Features: | Low ESL (Reverse Geometry) |
| Expanded Description: | 0.22µF ±20% 6.3V Ceramic Capacitor X5R 0306 (0816 Metric) |
| Description: | CAP CER 0.22UF 6.3V X5R 0306 |
| Capacitance: | 0.22µF |
| Applications: | Bypass, Decoupling |
| Email: | [email protected] |
Related parts for LG226D224MAT2S1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog