BYCHIPS is the stocking distributor for LFEC1E-3QN208C, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LFEC1E-3QN208C by email, we will give you a best price according your plan.
Buy LFEC1E-3QN208C with BYCHPS
Buy with guarantee
LFEC1E-3QN208C
- Part Number:
- LFEC1E-3QN208C
- Manufacturer:
- Lattice Semiconductor
- Description:
- IC FPGA 112 I/O 208QFP
- Lead Free Status / RoHS Status:
- Contains lead / RoHS non-compliant
- Available Quantity:
- 12806 Pieces
Introduction
Specifications
| Voltage - Supply: | 1.14 V ~ 1.26 V |
|---|---|
| Total RAM Bits: | 18432 |
| Supplier Device Package: | 208-PQFP (28x28) |
| Series: | EC |
| Package / Case: | 208-BFQFP |
| Operating Temperature: | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells: | 1500 |
| Number of I/O: | 112 |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Part Number: | LFEC1E-3QN208C |
| Description: | IC FPGA 112 I/O 208QFP |
| Email: | [email protected] |
Related parts for LFEC1E-3QN208C
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers