BYCHIPS is the stocking distributor for LDBCC3100JC5N0, we have the stocks for immediate shipping and also available for long time supply. Please send us your purchase plan for LDBCC3100JC5N0 by email, we will give you a best price according your plan.
Buy LDBCC3100JC5N0 with BYCHPS
Buy with guarantee
LDBCC3100JC5N0
- Part Number:
- LDBCC3100JC5N0
- Manufacturer:
- KEMET
- Description:
- CAP FILM 0.1UF 5% 50VDC 1812
- Lead Free Status / RoHS Status:
- Lead free / RoHS Compliant
- Available Quantity:
- 15309 Pieces
- Data sheet:
- 1.LDBCC3100JC5N0.pdf2.LDBCC3100JC5N0.pdf
Introduction
Specifications
| Voltage Rating - DC: | 50V |
|---|---|
| Voltage Rating - AC: | - |
| Tolerance: | ±5% |
| Termination: | Solder Pads |
| Size / Dimension: | 0.185" L x 0.130" W (4.70mm x 3.30mm) |
| Series: | LDB |
| Packaging: | Tape & Reel (TR) |
| Package / Case: | 1812 (4532 Metric) |
| Other Names: | 399-6410-2 DBCC3100JC5N0 |
| Operating Temperature: | -55°C ~ 125°C |
| Mounting Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Standard Lead Time: | 17 Weeks |
| Manufacturer Part Number: | LDBCC3100JC5N0 |
| Lead Spacing: | - |
| Height - Seated (Max): | 0.079" (2.00mm) |
| Features: | - |
| Expanded Description: | 0.1µF ±5% Film Capacitor 50V Polyphenylene Sulfide (PPS), Metallized - Stacked 1812 (4532 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielectric Material: | Polyphenylene Sulfide (PPS), Metallized - Stacked |
| Description: | CAP FILM 0.1UF 5% 50VDC 1812 |
| Capacitance: | 0.1µF |
| Applications: | General Purpose |
| Email: | [email protected] |
Related parts for LDBCC3100JC5N0
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers